The bench, which is used for electroplating of metals onto various substrates, has the following functional components installed:
Four working modules for electroplating: one each for nickel plating, copper plating, solder plating and gold plating, respectively, and one rinsing tank;
A movable rotation cathode jig mounted on a manually operated hoist track shall be allocated in appropriate position above the plating modules
Applications: Electroplating of metals onto various substrates.
Four working modules for electroplating: one each for nickel plating, copper plating, solder plating and gold plating, respectively, and one rinsing tank;
A movable rotation cathode jig mounted on a manually operated hoist track shall be allocated in appropriate position above the plating modules
Applications: Electroplating of metals onto various substrates.
The bench is used for electroless plating such electroless nickel or electroless copper.
The wet bench consists of two working modules for electro-less plating. Module 1 consists of six small tanks for preparation processes. Module 2 consists of two larger tanks for electro-less plating.
Applications: Electroless nickel or electroless copper.
Applications: Electroless nickel or electroless copper.
The bench is used for anodizing aluminium and its alloys.
It consists of six working modules.
Applications: Anodizing alumimium and its alloys.
The bench is used for anodizing magnesium and its alloys. It consists of six working modules.
Applications: Anodizing magnesium and its alloys.
The Electrodialysis (ED) system is used to transport ions from one solution through ion-exchange membranes to another solution under the influence of an applied electric potential.
Applications: Used to concentrate nickel solutions (or other solutions) and is also used for acid separation from a solution.
Other specific applications can also be explored by changing of the membrane system.
The UDP 550-4 unbalanced magnetron sputtering system has 4 targets installed in the cylindrical chamber wall. Different kinds of power suppliers (DC, pulsed DC and RF) are connected to the sputtering targets and/or substrates.
This system is useful for depositing various kinds of thin films, including metal and alloy coatings, single or multi-component ceramic (nitride, carbide, oxide, or their combination) coatings, self-lubricant coatings, transparent conductive coatings, etc., on different kinds of substrates, including metallic, ceramic, glass, silicon wafer, and some polymer materials
Applications: The as-deposited coatings can be widely applied on various cutting and forming tools, mold & dies and generic wear components, metallization of non-conductive substrates, anti-reflective and high transmittance optical components, and etc.
The pi80 vacuum arc system consists of two cathodes installed on the chamber door. The two cathodes will be rotating during coating deposition processes, which ensures the whole surface of the cathodes be effective for coating deposition and results in uniform erosion of the cathodes so as to maximize the service lifetime of the cathodes. The pi80 system has a special virtual shutter function, i.e. before coating deposition plasma can be guided back towards chamber wall for cathode cleaning and then the plasma, without interruption, is guided forward facing the substrates for coating deposition. This ensures a strong adhesion of the as-deposited coatings onto the substrates.
Applications: The p80 PVD system is particularly useful for depositing superhard nanocomposite coatings for application on various kinds of cutting and forming tools, mold & dies and wear components.
Applications: The p80 PVD system is particularly useful for depositing superhard nanocomposite coatings for application on various kinds of cutting and forming tools, mold & dies and wear components.
This is an electron cyclotron resonance plasma enhanced chemical vapor deposition system. In order to initiate a plasma and increase the ionization percentage in the plasma so as to enhance the chemical reaction in the reactor, a series of magnets are arranged around the chamber wall, a microwave is coupled into the reactor, and an RF bias source is applied to the substrates.
Applications: The ECR-CVD system is useful for plasma reactive dry etching and for depositing some thin films including diamond-like carbon, amorphous silicon, amorphous silicon nitride, and amorphous silicon oxide.
An integrated computerized thermal spray process where molten or semi-molten particles are applied by impact onto a substrate to produce a coating.
Applications: System is capable of depositing metals, metal alloy, cermets and thermoplastic coatings.
Applications: System is capable of depositing metals, metal alloy, cermets and thermoplastic coatings.
P2i employs a pulsed ionised gas (plasma) created within a vacuum chamber to produce polymeric nano-coating. Applications: Hydrophobic coating.
Deposit a thin uniform film on substrate from chemical vapor.
Applications: Deposit anti-bacterial or self cleaning coating.
Size and surface charge measurement.
Applications: Particle characterisation.
Applications: Particle characterisation.
Measurement of hydrophilicity/ hydrophobicity of surface.
Applications: Measurement water contact angle & surface tension.
Exposure of photocatalytic samples to UV (365nm) & visible light source.
Applications: Design for photocatalytic experiment to activate & study photocatyltic reactions.
The machine contains motorized moving head and a closed chamber with touch screen setting and controlling of dipping deposition parameters. Coating layer is applied on a flat substrate from wet chemical solutions with a controlled withdrawal speed in atmospheric or nitrogen environment.
Applications: Sol-gel coating on flat glass, metals, or plastics plates. Double sided coating.
