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Tel : (65) 6793 8360
Email :
ahcheong@SIMTech.a-star.edu.sg


6kW High Power Fiber Laser

6 kW fiber laser integrated with a 6-axis robot, ideal for welding, three dimensional additive manufacturing for the applications of repair, surface modification, rapid tooling and high productivity cladding in nearly all the industry sectors like PE, aerospace, marine, oil & gas, MedTech, etc.
Plasma Arc Welding
Welding & cladding of Ni-, Co-, Ti-, and other alloys, as well as stainless steels, for offshore and oil & gas and aerospace applications.
Variable polarity (VP) TIG welding

Welding & cladding of Ni-, Co-, Ti-, Al-, and Mg-alloys, and other alloys, as well as stainless steels and creep resistant steels, for offshore and oil & gas, aerospace, and marine applications.
Pulsed MIG/MAG welding (including FCAW)

Welding & cladding of steel and aluminum alloy structures used in shipbuilding, offshore and oil & gas applications.
Small Scale Resistance Spot Welding

Spot welding of steels, Ni-, Co-, Ti-, and Al-alloys, as well as precious metals, for applications in precision engineering sector.
Ultrasonic Plastic Welder

Welding of thermoplastics, such as ABS, PC, and PMMA. Localized heating with ultrasonic energy for some temperature sensitive applications.
Ultrasonic Bonder

Silicon; metal and polymer material bonding equipment.
Branson Digital Sonifier (Model S450D) - Ultrasonic Cell disruptor

Apply high frequency ultrasonic energy to biological and chemical processing to:
  1. Homogenize samples
  2. Disperse or mix compounds
  3. Accelerate reactions
Thinky Mixer ARV-310 Vacuum Centrifugal mixer

Mixer which is able to mix paste form materials and provide simultaneous processing of stirring, dispersion and deaeration without spillage.
Heidolph RZR 2051 Control Mechanical Stirrer
Provide high quality mixing with the speed range from 50~2000 rpm especially onto liquid or paste form materials, ability for monitoring of viscosity changes, maintain the speed even under load changes.
UV Flood Light Curing System

High energy UV system, useful for substrate cleaning and polymer curing.
DAGE shear tester

High energy UV system, useful for substrate cleaning and polymer curing.
Solderability tester

For assessing the mechanical properties of joints. Ball bond shear and wire pull for wire bonding. BGA solder ball shear.
Flip-Chip bonder

For assessing the wetting characteristics of solder-substrate systems.
Pick-and-place system

For flip-chip bonding. Flip chip on board.
PECVD system for CNT growth system

For electronics packaging application. SMT components assembly.
Wafer bonding system and aligner

For growth of single-walled, double-walled and multi-walled carbon nanotubes (CNT).
Gold wire bonder

For bonding of silicon wafers and glass wafers (anodic bonding, glass frit bonding, eutectic bonding).
Instron micro-force tester

Gold wire bonding on chip on board, chip on flexible substrate and ceramic substrate.
Reflow Oven

For assessing the mechanical properties of samples. SMT resistor/capacitor shear. Silicon die shear. SMT component leads pull. Material compression test. 3 points / 4 points bend test.
Solder Paste Printer

For reflowing solder materials. Leaded and lead-free.
Photolithography Facilities

For solder paste printing application.
Thin film metallisation facilities (PVD, plating)

For photolithography application.